FI168B250065-T [TAIYO YUDEN]
Ferrite Chip, 1 Function(s),;
| 型号： | FI168B250065-T |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Ferrite Chip, 1 Function(s), |
| 文件： | 总14页 (文件大小：2925K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2013. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor-
porating such products, which are caused under the conditions other than those specified in this catalog or indi-
vidual specification.
■ Please contact TAIYO YUDEN CO., LTD. for further details of product specifications as the individual specification
is available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in ad-
vance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may
occur in connection with a third party's intellectual property rights and other related rights arising from your usage
of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
MULTILAYER CERAMIC DEVICES / DIPLEXERS / BALUNS
■ ORDERING CODE
REFLOW
F I △ 2 1 2 B 2 4 5 0 2 6 ー T
❶
❷
❸
❹
❺
❻
❼
❶Device code
High Frequency
Devices
❷Electrode code
❸Dimensions code
［mm］
3.2×2.5
❹Special Code
Band Pass Type
Low Pass Type
Balance Type
Diplexer
❺Frequency〔MHz〕
example
❻Spec Code
01～ Individual Spec
❼Packaging
ーT Tape & Reel
△
With Plating
B
L
FI
325
212
168
105
△＝Blank space
2450
0620
2400～2500
470～770
2.0×1.25
1.6×0.8
1.0×0.5
C
P
T
Balun
D
Dual Type
■ EXTERNAL DIMENSIONS/STANDARD QUANTITY
FI 325P Type
FI 212B Type
FI 212B190223
FI 212L Type
3.2±0.20
1.6±0.10
1.0max
0.45max.
1.0±0.10
0.50±0.15
0.2±0.15
Unit : mm
Unit : mm
Unit : mm
0.55±0.20
Unit : mm
FI 212C249566/FI 212C355068
FI 168B/L Type
FI 212C Type
FI 212C245033/FI 212C245034
2.00±0.15
Unit : mm
Unit : mm
Unit : mm
Unit : mm
FI 168T Type
FI 168D Type
FI 212P Type
FI 212C245075
1.6±0.10
1.6±0.10
0.5max.
0.45max.
0.50±0.15
0.50±0.15
0.2±0.15
0.2±0.15
Unit : mm
Unit : mm
Unit : mm
Unit : mm
FI 168P Type
FI 105B/L Type
0.4 Max.
1.00±0.05
0.30±0.10
0.65Max
0.10±0.05
0.30±0.10
0.3±0.10
Unit : mm
Unit : mm
FI 212P245003/
FI212P089208/
FI212P085912
GND
Common Port Common Port GND
GND
Type
325P
212B
212L
212C
212P
168B
168L
168T
168D
168P
105B
105L
Standard Quantity［pcs］
FI 212C249566
FI 212C355068
FI 212P089213/
FI 212P085909
FI 168P245010/
FI 168P245023
FI 325P Type
FI 212C2450XX
FI 212C245051
FI 168T Type
Unbalance
FI 168D087018
FI 168P 157519
2000
（1） GND
Balanced
GND
Balanced
GND
Balanced
GND
Balanced
GND
Balanced
GND
Balanced
GND
GND
GND
High Band IN
GND
Low Band IN
GND
High Band
Common
3000～
6000
（2） Common
（3） GND
Low Band
Common
High Band
ー
GND
Low Band
GND
Balanced
Balanced
GND
（4） High Band
（5） GND
High Band
GND
Low Band OUT Low Band
Unbalance
Unbalance
Unbalance
GND
High Band
OUT
ー
ー
4000～
8000
（6） Low Band
DC
NC
NC or DC
Low Band
High Band
NC
ー
ー
（7）
（8）
ー
ー
NC
GND
NC
GND
NC
GND
ー
ー
ー
ー
ー
ー
ー
ー
ー
ー
ー
10000
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
127
■ PART NUMBERS
●Multi-layer Device band pass Type
Applications
External dimensions
2.0×1.25×1.0 max.
1.6×0.8×0.5 max.
1.0×0.5×0.4 max.
1.6×0.8×0.5 max.
2.0×1.25×1.0 max.
Ordering code
Notes
FI 212B245026/FI 212B245027
FI 168B245001
2.4GHz W-LAN
Bluetooth
FI 105B245024
WiMAX
PHS
FI 168B250065/FI168B24956D
FI 212B190223
●Multi-layer Device low pass Type
●Multi-layer Device balance Type
Applications External dimensions Ordering code
Notes
Applications External dimensions Ordering code Notes
Digital TV 1.6×0.8×0.45 max. FI 168L062005
Thickness 0.45 mm max.
Thickness 0.45 mm max.
2.0×1.25×1.0 max. FI 212C245032 Conjugated match to CSR BC4
2.0×1.25×1.0 max. FI 212C245033 Conjugated match to CSR BC3
WiMAX
1.6×0.8×0.45 max. FI 168L259764
2.0×1.25×1.0 max. FI 212C245034 Conjugated match to CSR BC4-BGA
2.0×1.25×1.0 max. FI 212C245036 Conjugated match to CSR BC5
2.0×1.25×1.0 max. FI 212C245051 Conjugated match to STLC2500C-D
2.0×1.25×0.7 max. FI 212C245075 Conjugated match to CSR BC5FM, BC6ROM
2.4GHz W-LAN
Bluetooth
1.0×0.5×0.4 max.
FI 105L250014
Thickness 0.4 mm max.
Dual band LPF
Bluetooth
Other
1.6×0.8×0.45 max. FI 168D087018
2.0×1.25×0.5 max. FI 212C249566 Thickness 0.5 mm max.
2.0×1.25×0.5 max. FI 212C355068 Thickness 0.5 mm max.
WiMAX
●Multi-layer diplexer
●Multi-layer Balun
Applications External dimensions Ordering code
Notes
Applications External dimensions Ordering code Notes
2.0×1.25×1.0 max.
FI 212P245003
FI 168P245010
FI 168P245023
FI 212P089208
FI 212P089213
FI 212P085909
FI 212P085912
BS
1.6×0.8×0.5 max. FI 168T155021 Thickness 0.5 mm max.
W-LAN
Cellular
1.6×0.8×0.65 max.
2.0×1.25×1.0 max.
GPS/
2.4GHz W-LAN
1.6×0.8×0.65 max. FI 168P157519
BS
3.2×2.5×1.0 max.
FI325P120057
■ ELECTRICAL CHARACTERISTICS・TYPICAL CHARACTERISTICS
FI 212B245026
FI 105B245024
Pass band frequency 2400 - 2500 MHz
Pass band frequency 2400-2500MHz
㻓
2.6 dB max（. 25 deg-C）
2.9 dB max（. －40～＋85 deg-C）
3.0 dB max（. 25 deg-C）
3.3 dB max（. －40～＋85 deg-C）
Insertion loss at
pass band
Insertion loss at
pass band
㻐㻔㻓
㻐㻕㻓
㻐㻖㻓
㻐㻗㻓
㻐㻘㻓
㻐㻙㻓
㻐㻚㻓
Ripple at
pass band
V.S.W.R. at
pass band
Ripple at pass band 1.0 dB max.
1.0 dB max.
V.S.W.R. at pass band 2.2 max.
25 dB min（. 880 - 960 MHz）
2.0 max.
22 dB min（. 1710 - 1910 MHz）
20 dB min（. 4800 - 5000 MHz）
20 dB min（. 7200 - 7500 MHz）
Attenuation
40 dB min（. 800 - 960 MHz）
30 dB min（. 1710 - 1990 MHz）
25 dB min（. 2110 - 2170 MHz）
30 dB min（. 4800 - 5000 MHz）
30 dB min（. 7200 - 7500 MHz）
50 ohm
㻘㻓㻓 㻔㻘㻓㻓 㻕㻘㻓㻓 㻖㻘㻓㻓 㻗㻘㻓㻓 㻘㻘㻓㻓 㻙㻘㻓㻓 㻚㻘㻓㻓 㻛㻘㻓㻓
㻓㻑㻓
㻕㻑㻓
㻗㻑㻓
㻙㻑㻓
㻛㻑㻓
Attenuation
Impedance
FI 168B250065
Pass band frequency 2300 - 2700 MHz
2.4 dB max（. 25 deg-C）
2.6 dB max（. －30～＋85 deg-C）
2.3 dB max.（25 deg-C）
Insertion loss at
2300 - 2500 MHz
FI 212B245027
Insertion loss at
2500 - 2700 MHz
Pass band frequency 2400-2500MHz
2.5 dB max.（－30～＋85 deg-C）
1.4 dB max（. 25 deg-C）
1.7 dB max（. －40～＋85 deg-C）
Ripple at pass band 1.0 dB max.
Insertion loss at
pass band
Ripple at
2300 - 2500 MHz
1.4 dB max.
1.3 dB max.
2.4 max.
Ripple at
2500 - 2700 MHz
V.S.W.R. at pass band 2.0 max.
㻓㻑㻓
㻕㻑㻓
㻗㻑㻓
㻙㻑㻓
㻛㻑㻓
30 dB min（. 800 - 915 MHz）
V.S.W.R. at
2300 - 2500 MHz
30 dB min（. 1710 - 1910 MHz）
6 dB min（. 2110 - 2170 MHz）
20 dB min（. 4800 - 5000 MHz）
Attenuation
V.S.W.R. at
2500 - 2700 MHz
㻘㻓㻓
㻔㻘㻓㻓
㻕㻘㻓㻓
㻖㻘㻓㻓
㻗㻘㻓㻓 㻘㻘㻓㻓
1.3 max.
15 dB min（. 1500 - 2000 MHz）
10 dB min（. 4600 - 8000 MHz）
50 ohm
Attenuation
Impedance
FI 168B245001
Pass band frequency 2400 – 2500MHz
FI 168B24956D
2.2 dB（25deg-C）
2.5 dB（－30～＋85deg-C）
Ripple at pass band 1.0 dB max.
Insertion loss at
pass band
Pass band frequency 2300 - 2690MHz
2.3 dB（25deg-C）
2.6 dB（ 30～+85deg-C）
Insertion loss at
V.S.W.R. at pass band 2.1 max.
pass band
－
25 dB min.（880 – 960MHz）
Ripple at pass
band
0.8 dB max.
25 dB min.（1710 – 1910MHz）
20 dB min.（4800 – 5000MHz）
20 dB min.（7200 – 7500MHz）
50 ohm
Attenuation
Impedance
V.S.W.R. at pass
band
2.1 max.
15 dB min. (DC-1620MHz)
23 dB min. (3490-4000MHz)
25 dB min. (4490-8000MHz)
50 ohm
㻔㻑㻓
㻕㻑㻓
㻖㻑㻓 㻗㻑㻓
㻘㻑㻓
㻙㻑㻓
㻚㻑㻓
㻛㻑㻓
Attenuation
Impedance
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
128
■ ELECTRICAL CHARACTERISTICS・TYPICAL CHARACTERISTICS
FI 212B190223
FI 168D087018
Pass band frequency 1884-1930MHz
Low band
0
-10
-20
-30
-40
-50
1.7 dB max.（25deg-C）
2.0 dB max.（－30-＋85deg-C）
1.7 dB max.（25deg-C）
Pass band frequency 824 – 915 MHz
Insertion Loss at
1884-1920MHz
Insertion loss at
824 – 915 MHz
0.6 dB max（. －30 to +85 Deg.C）
Insertion Loss at
1920-1930MHz
V.S.W.R.
at 824 – 915 MHz
2.0 dB max.（－30-＋85deg-C）
1.5 max.
Ripple at Pass band 1.0 dB max.
S11
S21
25 dB min.（1648-1830MHz）
25 dB min.（2472-2745MHz）
50 ohm
V.S.W.R. at Pass band 2.0 max.
Attenuation
30 dB min.（1420MHz）
18 dB min.（3768-3860MHz）
50 ohm
0.0
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0
Attenuation
Impedance
Impedance
High band
0
-10
-20
-30
-40
-50
Pass band frequency 1710 – 1910 MHz
Insertion loss at
1710 – 1910 MHz
0.6 dB max（. －30 to +85 Deg.C）
FI 168L062005
V.S.W.R.
at 824 – 915 MHz
Pass band frequency 470 – 770 MHz
1.5 max.
S11
S21
1.2 dB max.（25 deg-C）
1.3 dB max.（－30～＋85 deg-C）
2.2 dB max.（25 deg-C）
2.4 dB max.（－30～＋85 deg-C）
4.0 dB max.（25 deg-C）
4.4 dB max.（－30～＋85 deg-C）
Insertion loss at
25 dB min.（3420-3820MHz）
25 dB min.（5130-5730MHz）
50 ohm
470-600MHz
Attenuation
Insertion loss at
600-710MHz
0.0
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0
Impedance
Isolation
Insertion loss at
710-770MHz
27 dB min.（824-915MHz）
30 dB min.（1710-1910MHz）
30 dB min.（824-915MHz）
30 dB min.（1710-1910MHz）
In to In/Out to Out
In to Out
Ripple at 470 – 710 MHz 1.4 dB max.
2.0 max.（470 – 710 MHz）
2.5 max.（710 – 770 MHz）
V.S.W.R.
25 dB min.（888 – 925 MHz）
（25 deg-C）
FI 212C245032
21 dB min.（888 – 925 MHz）
（－30～＋85 deg-C）
Pass band frequency 2400-2500MHz
3.7 dB（25deg-C）
4.0 dB（－30～＋85deg-C）
Insertion loss at
pass band
Attenuation
25 dB min.（940 – 960 MHz）
27 dB min.（1429 – 1453 MHz）
26 dB min.（1920 – 1980 MHz）
26 dB min.（2400 – 2500 MHz）
50 ohm
Ripple at pass band 1.0 dB max.
Unbalanced port
2.0 max.
V.S.W.R. at pass band
Impedance
Balanced port V.S.W.R.
2.0 max.
at pass band
Amplitude Imbalance
2.0 dB max.
FI 168L259764
at pass band
470 – 770 MHz
Pass band frequency
Phase Imbalance
180 ＋/－ 10 deg
2300 – 2700 MHz
at pass band
0.5 dB max.（25 deg-C）
0.6 dB max.（－30～＋85 deg-C）
0.5 dB max.（25 deg-C）
0.6 dB max.（－30～＋85 deg-C）
Insertion loss at
470-770MHz
35 dB min.（880-960MHz）
20 dB min.（1710-1990MHz）
20 dB min.（1990-2170MHz）
20 dB min.（4800-5000MHz）
Attenuation
Insertion loss at
2300-2700MHz
Ripple at 470 – 770 MHz 0.3 dB max.
Unbalanced Port
Impedance
50 ohm
Ripple at 2300 – 2700 MHz 0.3 dB max.
V.S.W.R.at 470 – 770MHz
2.0 max.
Balanced Port
Impedance
Conjugated match to CSR BC4
V.S.W.R.at 2300 – 2700MHz 2.0 max.
20 dB min.（4600 – 5400 MHz）
20 dB min.（6900 – 8100 MHz）
50 ohm
Attenuation
Impedance
FI 212C245033
Pass band frequency 2400-2500MHz
2.7 dB（25deg-C）
3.0 dB（－30～＋85deg-C）
Insertion loss at pass
band
FI 105L250014
Pass band frequency 2400-2500MHz
Ripple at pass band 1.0 dB max.
0.45 dB max（. 25 deg-C）
0.55 dB max（. －40～＋85 deg-C）
Unbalanced port
2.0 max.
Insertion loss at
2400 - 2500 MHz
V.S.W.R. at pass band
Balanced port V.S.W.R.
2.0 max.
V.S.W.R. at
2400 - 2500 MHz
1.7 max.
at pass band
Amplitude Imbalance
2.0 dB max.
21 dB min（. 4800 - 5000 MHz）
21 dB min（. 7200 - 7500 MHz）
50 ohm
Attenuation
Impedance
at pass band
Phase Imbalance
180 ＋/－ 10 deg
㻓㻑㻓
㻕㻑㻓
㻗㻑㻓
㻙㻑㻓
㻛㻑㻓
at pass band
25 dB min.（880-960MHz）
15 dB min.（1710-1990MHz）
15 dB min.（1990-2170MHz）
15 dB min.（4800-5000MHz）
Attenuation
Unbalanced Port Impedance 50 ohm
Balanced Port
Impedance
Conjugated match to CSR BC3
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
129
■ ELECTRICAL CHARACTERISTICS・TYPICAL CHARACTERISTICS
FI 212C245034
FI 212C245075
Pass band frequency 2400-2500MHz
Pass band frequency 2400-2500MHz
㻓
㻓
2.7 dB max（. 25 deg-C）
3.0 dB max（. －30～＋85 deg-C）
Ripple at pass band 1.0 dB max.
3.7 dB（25deg-C）
4.0 dB（－30～＋85deg-C）
Ripple at pass band 1.0 dB max.
Insertion loss at
pass band
㻐㻔㻓
㻐㻕㻓
Insertion loss at
pass band
㻐㻕㻓
㻐㻗㻓
㻐㻖㻓
㻐㻗㻓
㻐㻘㻓
㻶㼇㼖㻕㻔
㻶㼇㼖㻔㻔
㻶㼇㼇㻕㻕
Amp. balance at
2.0 dB Max.
Passband
Unbalanced port
2.2 max.
㻐㻙㻓
V.S.W.R. at pass band
㻐㻛㻓
Phase Balance at
Passband
Balanced port V.S.W.R.
2.2 max.
㻐㻙㻓
㻐㻚㻓
180 ＋/－ 10 deg
at pass band
㻐㻔㻓㻓
㻔㻑㻓
㻕㻑㻓
㻖㻑㻓
㻓㻑㻛
㻔㻑㻕
㻔㻑㻙
㻕㻑㻓
㻕㻑㻗
㻕㻑㻛
Unbalanced Port
V.S.W.R at Passband
Amplitude Imbalance
2.0 dB max.
2.0 max.
2.0 max.
at pass band
㻓
㻓
㻐㻕㻓
Balanced Port
V.S.W.R at Passband
Phase Imbalance
at pass band
㻐㻔㻓
㻐㻕㻓
180 ＋/－ 10 deg
㻐㻖㻓
㻐㻗㻓
25 dB min（. 880 - 960 MHz）
15 dB min（. 1710 - 1990 MHz）
12 dB min（. 1990 - 2170 MHz）
15 dB min（. 4800 - 5000 MHz）
40 dB min.（880-960MHz）
18 dB min.（1710-1990MHz）
12 dB min.（1990-2170MHz）
30 dB min.（4800-5000MHz）
㻐㻗㻓
㻐㻘㻓
Attenuation
Attenuation
㻐㻙㻓
㻐㻚㻓
㻐㻙㻓
㻐㻛㻓
㻐㻛㻓
㻐㻜㻓
Unbalanced Port
Impedance
Unbalanced Port
Impedance
㻐㻔㻓㻓
㻓㻑㻓
㻐㻔㻓㻓
㻓㻑㻘
50 ohm
50 ohm
㻕㻑㻓
㻗㻑㻓
㻙㻑㻓
㻔㻑㻘
㻕㻑㻘
㻖㻑㻘
㻗㻑㻘
㻘㻑㻘
Balanced Port
Impedance
Conjugated to CSR BC4-BGA,
BC5-BGA
Balanced Port
Impedance
Conjugated match to CSR
BC5FM.BC6ROM
FI 212C245036
FI 212C249566
Pass band frequency 2400-2500MHz
Pass band frequency 2300-2690MHz
3.7 dB（25deg-C）
4.0 dB（－30～＋85deg-C）
Ripple at pass band 1.0 dB max.
Insertion loss at
pass band
2.9 dB max.（25 deg-C）
3.2 dB max.（－30～＋85 deg-C）
Ripple at 2300-2495MHz 1.2 dB max.
Insertion loss
at 2300-2495MHz
Unbalanced port
2.0 max.
Unbalanced port V.S.W.R.
2.3 max.
V.S.W.R. at pass band
at 2300-2495MHz
Balanced port V.S.W.R.
2.0 max.
Balanced port V.S.W.R.
2.3 max.
at pass band
at 2300-2495MHz
Amplitude Imbalance
2.0 dB max.
Amplitude Imbalance
2.0 dB max.
at pass band
at 2300-2495MHz
Phase Imbalance
at pass band
Phase Imbalance
at 2300-2495MHz
180 ＋/－ 10 deg
180 ＋/－ 12 deg
35 dB min.（880-960MHz）
20 dB min.（1710-1990MHz）
15 dB min.（1990-2170MHz）
20 dB min.（4800-5000MHz）
2.3 dB max.（25 deg-C）
2.6 dB max.（－30～＋85 deg-C）
Ripple at 2495-2690MHz 1.0 dB max.
Insertion loss
at 2495-2690MHz
Attenuation
Unbalanced port V.S.W.R.
2.3 max.
at 2495-2690MHz
Unbalanced Port Impedance 50 ohm
Balanced port V.S.W.R.
2.3 max.
Balanced Port
Impedance
Conjugated match to CSR BC5
at 2495-2690MHz
Amplitude Imbalance
2.0 dB max.
at 2495-2690MHz
FI 212C245051
Phase Imbalance
180 ＋/－ 12 deg
Pass band frequency 2400-2500MHz
at 2495-2690MHz
3.7 dB（25deg-C）
4.0 dB（－30～＋85deg-C）
Ripple at pass band 1.0 dB max.
40 dB Min.（824-960MHz）
15 dB Min.（1710-1990MHz）
20 dB Min.（4900-5850MHz）
50 : 100
Insertion loss at
pass band
Attenuation
Unbalanced port
2.0 max.
Impedance
V.S.W.R. at pass band
Balanced port V.S.W.R.
2.0 max.
FI 212C355068
at pass band
Pass band frequency 3300-3800MHz
Amplitude Imbalance
2.0 dB max.
at pass band
2.5 dB（25 deg-C）
2.8 dB（-30～+85 deg-C）
Insertion loss at
pass band
Phase Imbalance
at pass band
180 ＋/－ 10 deg
Ripple at pass
band
1.0 dB max.
40 dB min.（824 – 960MHz）
12 dB min.（1570-1580MHz）
27 dB min.（1710-1785MHz）
25 dB min.（1805-1880MHz）
23 dB min.（1880-1910MHz）
20 dB min.（4800-5000MHz）
Unbalanced port
V.S.W.R. at pass band
2.3 max.
Attenuation
Balanced port
V.S.W.R. at pass band
2.3 max.
2.0
3.0
4.0
Amplitude
imbalance at pass 2.0 dB max.
band
Unbalanced Port
Impedance
50 ohm
Phase imbalance
180 ＋/－ 12 deg
Balanced Port
Impedance
Conjugated match to
STLC2500C-D
at pass band
Attenuation
Impedance
40 dB min.（1710-1990MHz）
40 dB min.（2110-2170MHz）
35 dB min.（2400-2500MHz）
15 dB min.（4900-5850MHz）
50:100
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
130
■ ELECTRICAL CHARACTERISTICS・TYPICAL CHARACTERISTICS
FI 212P245003
FI 212P089208
Low band
Low band
Pass band frequency 2400-2500MHz
Pass band frequency 698 – 960 MHz
0.5 dB max.（25 deg-C）
0.7 dB max.（－30～＋85 deg-C）
2.0 max.
0.27 dB max（. ＋25 Deg.C）
Insertion loss
at 2400-2500MHz
Insertion loss
at 698 – 960 MHz
0.32 dB max（. －40 to ＋85 Deg.C）
V.S.W.R. at
698 – 960 MHz
V.S.W.R.
2.0 max.
14 dB min.（4900-5150MHz）
20 dB min.（5150-5350MHz）
14 dB min.（5470-5825MHz）
Attenuation
13dB min. (1710-2170MHz)
50 ohm
Attenuation
High band
0
1.0
2.0
3.0 Impedance
High band
Pass band frequency
1710 – 2170 MHz
Pass band frequency 1 4900-5150MHz
Pass band frequency 2 5150-5350MHz
Pass band frequency 3 5470-5825MHz
0.45 dB max（. +25 Deg.C）
0.55 dB max（. －40 to ＋85 Deg.C）
Insertion loss at
1710 – 2170 MHz
V.S.W.R. at
698 – 960 MHz
2.0 max.
0.7 dB max.（25 deg-C）
Insertion loss at
pass band 1
0.9 dB max.（－30～＋85 deg-C）
0.6 dB max.（25 deg-C）
0.8 dB max.（－30～＋85 deg-C）
0.9 dB max.（25 deg-C）
1.0 dB max.（－30～＋85 deg-C）
2.0 max.（band-1.-2）
Attenuation
Impedance
19dB min.（698-960MHz）
Insertion loss at
pass band 2
50 ohm
FI 212P089213
Insertion loss at
pass band 3
Low band
Pass band frequency 698 – 960 MHz
V.S.W.R.
2.5 max.（band-2）
0.27 dB max（. ＋25 Deg.C）
Insertion loss
at 698 – 960 MHz
Attenuation
20 dB min.（2400-2500MHz）
0.32 dB max（. －40 to ＋85 Deg.C）
V.S.W.R. at
698 – 960 MHz
2.0 max.
FI 168P245010
Attenuation
Impedance
13dB min. (1710-2170MHz)
50 ohm
Low band
Pass band frequency 2400-2500MHz
0
-10
-20
-30
0
1.0
2.0
3.0
High band
0.40 dB max.（25 deg-C）
Insertion loss
Pass band frequency
1710 – 2170 MHz
at 2400-2500MHz
0.50 dB max.（－40～＋85 deg-C）
0.45 dB max（. ＋25 Deg.C）
Insertion loss at
1710 – 2170 MHz
V.S.W.R.
at 2400 – 2500 MHz
2.0 max.
0.55 dB max（. －40 to
＋85 Deg.C）
V.S.W.R. at
698 – 960 MHz
20 dB min.（4900-5850MHz）
15 dB min.（5850-8500MHz）
50 ohm
2.0 max.
Attenuation
-40
0
2
4
6
8
10
12
Attenuation
Impedance
19dB min.（698-960MHz）
Impedance
50 ohm
High band
Pass band frequency
4900 – 5850 MHz
FI 212P085909
0.60 dB max.（25 deg-C）
0.70 dB max.（－40～＋85 deg-C）
Insertion loss
at 4900 – 5850 MHz
Low band
0
V.S.W.R.
at 4900 – 5850 MHz
Pass band frequency 698–960 MHz
2.0 max.
-10
0.70 dB max（. +25 deg-.C）
0.75 dB max（. -30～+85 deg-.C）
Insertion loss
at 698 – 960 MHz
-20
-30
Attenuation
Impedance
20 dB min.（2400-2500MHz）
50 ohm
V.S.W.R.
at 698 – 960 MHz
1.6 max.
-40
-50
-60
19dB min.（1558–1570MHz）
20dB min.（1570–1580MHz）
19dB min.（1580–1610MHz）
50 ohm
FI 168P245023
Attenuation
0.5
1.0
1.5
2.0
2.5
Low band
0
-10
-20
-30
Pass band frequency 2400-2500MHz
Impedance
High band
0.60 dB max.（25 deg-C）
Insertion loss
at 2400-2500MHz
0.70 dB max.（－40～＋85 deg-C）
Pass band frequency 1 1558–1570MHz
V.S.W.R.
at 2400 – 2500 MHz
2.0max.
Pass band frequency 2 1570–1580MHz
Pass band frequency 3 1580–1610MHz
20 dB min.（4800-6000MHz）
20 dB min.（7200-7500MHz）
50 ohm
Attenuation
-40
0.75 dB max（. +25 deg-.C）
Insertion loss
0
2
4
6
8
10
12
at 1558 – 1570 MHz
0.85 dB max（. -30～+85 deg-.C）
0.70 dB max（. +25 deg-.C）
0.80 dB max（. -30～+85 deg-.C）
0.70 dB max（. +25 deg-.C）
0.80 dB max（. -30～+85 deg-.C）
Impedance
High band
Insertion loss
at 1570 – 1580 MHz
Pass band frequency
4900 – 5950 MHz
0.80 dB max.（25 deg-C）
0.95 dB max.（－40～＋85 deg-C）
Insertion loss
at 4900 – 5850 MHz
Insertion loss
at 1580 – 1610 MHz
V.S.W.R.
at 4900 – 5850 MHz
V.S.W.R.
at 1558 – 1570 MHz
2.0max.
1.6 max.
1.6 max.
1.6 max.
20 dB min.（1800-2500MHz）
V.S.W.R.
at 1570 – 1580 MHz
Attenuation
Impedance
20 dB min.（9800-11900MHz）
*Referece
V.S.W.R.
at 1580 – 1610 MHz
50 ohm
Attenuation
35dB min.（698–824MHz）
42dB min.（824–894MHz）
25dB min.（894–960MHz）
50 ohm
Impedance
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
131
■ ELECTRICAL CHARACTERISTICS・TYPICAL CHARACTERISTICS
FI 212P085912
FI 325P120057
Low band
Low band
0
0
-10
-20
-30
-40
-50
Pass band frequency 698–960 MHz
Pass band frequency
900 – 1450 MHz
-10
0.70 dB max（. +25 deg-.C）
0.75 dB max（. -30～+85 deg-.C）
4.00 dB max（. +25 deg-.C）
4.40 dB max（. -40～+85 deg-.C）
3.0 dB max（. +25 deg-.C）
3.4 dB max（. -40～+85 deg-.C）
Insertion loss
at 698 – 960 MHz
Insertion loss
at 900 – 1450 MHz
-20
-30
-40
-50
-60
V.S.W.R.
at 698 – 960 MHz
Ripple
at 900 – 1450 MHz
1.6 max.
-60
-70
0
19dB min.（1558–1570MHz）
20dB min.（1570–1580MHz）
19dB min.（1580–1610MHz）
50 ohm
V.S.W.R.
at 900 – 1450 MHz
2.2 max.
Attenuation
1
2
3
0.5
1.0
1.5
2.0
2.5
44dB min.（1650–2200MHz（）+25 deg-.C）
40dB min.（1650–2200MHz（）-40～+85 deg-.C）
45dB min.（1650MHz（）+25 deg-.C）
41dB min.（1650MHz（）-40～+85 deg.-C）
50 ohm
Impedance
High band
Attenuation
Pass band frequency 1 1558–1570MHz
Pass band frequency 2 1570–1580MHz
Pass band frequency 3 1580–1610MHz
Impedance
High Band
0.75 dB max（. +25 deg-.C）
Insertion loss
at 1558 – 1570 MHz
Pass band frequency 1650 – 2200 MHz
0.85 dB max（. -30～+85 deg-.C）
0.70 dB max（. +25 deg-.C）
0.80 dB max（. -30～+85 deg-.C）
0.70 dB max（. +25 deg-.C）
0.80 dB max（. -30～+85 deg-.C）
4.00 dB max（. +25 deg-.C）
Insertion loss
at 1650 – 2200 MHz 4.40 dB max（. -40～+85 ｄeg-.C）
Insertion loss
at 1570 – 1580 MHz
3.0 dB max（. +25 deg-.C）
Ripple
at 1650 – 2200 MHz 3.2 dB max（. -40 to +85 Deg.C）
Insertion loss
at 1580 – 1610 MHz
V.S.W.R.
at 1650 – 2200 MHz
2.25 max.
V.S.W.R.
at 1558 – 1570 MHz
1.6 max.
1.6 max.
1.6 max.
44dB min.（900–1450MHz（）+25 deg-.C）
40dB min.（900–1450MHz（） -40～+85 deg-.C）
V.S.W.R.
at 1570 – 1580 MHz
Attenuation
45dB min.（1450MHz（）+25 deg-.C）
V.S.W.R.
at 1580 – 1610 MHz
41dB min.（1450MHz（）-40～+85 deg-.C）
Impedance
50 ohm
35dB min.（698–824MHz）
42dB min.（824–894MHz）
25dB min.（894–960MHz）
50 ohm
Attenuation
Impedance
FI 168T155021
Pass band frequency 900-2200MHz
㻓㻑㻓
㻐㻓㻑㻘
㻐㻔㻑㻓
㻗㻑㻓
㻖㻑㻘
㻖㻑㻓
2.0 dB max（. 25 deg-C）
2.3 dB max（. -30～+85 deg-C）
Insertion loss at
pass band
㻶㼖㼖㻔㻔
㻶㼇㼖㻕㻔
V.S.W.R. at pass band 2.3 max.
FI 168P157519
㻐㻔㻑㻘
㻐㻕㻑㻓
㻕㻑㻘
㻕㻑㻓
Phase balance
at pass band
Low band
180 ＋/－ 20 deg
0
Pass band frequency 0 824–960MHz
㻐㻕㻑㻘
㻐㻖㻑㻓
㻔㻑㻘
㻔㻑㻓
Amplitude Imbalance
at pass band
-10
-20
＋/－2 dB max.
Pass band frequency 1 1558–1585MHz
Pass band frequency 2 1585–1610MHz
㻓㻑㻘
㻔㻑㻓
㻔㻑㻘
㻕㻑㻓
㻕㻑㻘
Impedance
50 : 75
-30
-40
-50
0.50 dB max（. +25 deg-.C）
㻖
㻕
㻔
㻓
㻕㻔㻓
Insertion loss
at 824 – 960 MHz
㻤㼐㼓㼏㼌㼗㼘㼇㼈
㻳㼋㼄㼖㼈
㻕㻓㻓
㻔㻜㻓
㻔㻛㻓
0.60 dB max（. -40～+85 deg-.C）
0.40 dB max（. +25 deg-.C）
0.50 dB max（. -40～+85 deg-.C）
0.45 dB max（. +25 deg-.C）
0.55 dB max（. -40～+85 deg-.C）
Insertion loss
at 1558 – 1585 MHz
0.0
1.0
2.0
3.0
㻐㻔
㻐㻕
㻔㻚㻓
㻔㻙㻓
Insertion loss
at 1585 – 1610 MHz
㻐㻖
㻔㻘㻓
㻕㻑㻘
㻓㻑㻘
㻔㻑㻓
㻔㻑㻘
㻕㻑㻓
V.S.W.R.
at 824 – 960 MHz
2.0 max.
2.0 max.
2.0 max.
V.S.W.R.
at 1558 – 1585 MHz
V.S.W.R.
at 1585 – 1610 MHz
Attenuation
Impedance
High Band
13dB min.（2400-2500MHz）
50 ohm
Pass band frequency 2400 – 2500 MHz
Insertion loss
0.60 dB max（. +25 deg-.C）
at 2400 – 2500 MHz 0.70 dB max（. -40～+85 deg-.C）
V.S.W.R.
at 2400 – 2500 MHz
2.0 max.
12dB min.（824–960MHz）
Attenuation
Impedance
23dB min.（1558–1585MHz）
20dB min.（1585–1610MHz）
50 ohm
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
132
MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS)
■PACKAGING
①Minimum Quantity
Type
325P
212B
212L
212C
212P
168B
168L
168T
168D
168P
105B
105L
Embossed Tape [pcs]
2000
3000
4000
10000
②Tape Material
●Embossed Tape
●Card Board Cattier Tape
Top tape
Top tape
Base tape
Sprocket hole
Chip cavity
Sprocket hole
Chip cavity
Bottom tape
Base tape
Chip Filled
Chip
●Taped package
Type (EIA)
Thickness
Standard Quantity [pcs]
mm (inch)
325P
212B
0.90 typ.（0.035）
0.90 typ.（0.035）
0.45 typ.（0.018）
0.90 typ.（0.035）
0.90 typ.（0.035）
0.45 typ.（0.018）
0.60 typ.（0.024）
0.45 typ.（0.018）
0.45 typ.（0.018）
0.45 typ.（0.018）
0.45 typ.（0.018）
0.60 typ.（0.024）
0.30 typ.（0.0118）
0.30 typ.（0.0118）
2000
212L
212C
3000
212P
212C-0.5
212C-0.7
168B
168L
168T
4000
168D
168P
105B
10000
105L
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_pack_e-E02R01
③Taping Dimensions
●Embossed tape 0.315 inches wide
(325P Type, 212B Type, 212C Type, 212C-0.7 Type, 212P Type）
Unit：mm（inch）
Insertion Pitch
Chip cavity
Type（EIA）
Tape Thickness max.
A
B
F
K
T
0.3
2.75±0.2
3.55±0.2
4.0±0.1
1.35
325P
212B
（0.108±0.008）
1.55±0.2
（0.14±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.053）
1.6
（0.012）
0.3
（0.061±0.008）
1.55±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.063）
1.6
（0.012）
0.3
212C
（0.061±0.008）
1.55±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.063）
1.3
（0.012）
0.3
212C-0.7
212P
（0.061±0.008）
1.55±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.051）
1.6
（0.012）
0.3
（0.061±0.008）
（0.091±0.008）
（0.157±0.004）
（0.063）
（0.012）
Unit：mm（inch）
●Paper tape 0.315 inches wide
(212L Type, 212C-0.5 Type, 168B Type, 168L Type, 168P Type, 168T Type, 168DType, 105B Type, 105L Type）
Unit：mm（inch）
Chip cavity
Insertion Pitch
F
Tape Thickness max.
T
Type（EIA）
212L
A
B
1.55±0.2
2.3±0.2
4.0±0.1
0.65
（0.061±0.008）
1.55±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.026）
0.3
212C-0.5
168B
（0.061±0.008）
1.00±0.05
（0.091±0.008）
1.80±0.05
（0.157±0.004）
4.0±0.1
（0.012）
0.55
（0.039±0.002）
1.00±0.05
（0.071±0.002）
1.80±0.05
（0.157±0.004）
4.0±0.1
（0.022）
0.55
168L
（0.039±0.002）
1.00±0.05
（0.071±0.002）
1.80±0.05
（0.157±0.004）
4.0±0.1
（0.022）
0.55
168T
（0.039±0.002）
1.00±0.05
（0.071±0.002）
1.80±0.05
（0.157±0.004）
4.0±0.1
（0.022）
0.55
168D
（0.039±0.002）
0.95±0.05
（0.071±0.002）
1.80±0.05
（0.157±0.004）
4.0±0.1
（0.022）
0.80
168P
（0.037±0.002）
0.62±0.03
（0.071±0.002）
1.12±0.03
（0.157±0.004）
2.0±0.05
（0.031）
0.45
105B
（0.024±0.001）
0.62±0.03
（0.044±0.001）
1.12±0.03
（0.079±0.002）
2.0±0.05
（0.018）
0.45
105L
（0.024±0.001）
（0.044±0.001）
（0.079±0.002）
（0.018）
Unit：mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_pack_e-E02R01
④Leader and Blank Portion
⑤Reel size
t
E
C
B
A
R
D
W
A
B
C
D
E
R
φ178±2.0
φ50min.
φ13.0±0.2
φ21.0±0.8
2.0±0.5
1.0
（φ7.01±0.079）
（φ1.97 min.）
（φ0.512±0.008）
（φ0.827±0.031）
（0.079±0.020）
t
W
8mm width tape
（0.315 inches width）
12mm width tape
2.5max.
10±1.5
（0.098max.）
2.5max.
（0.394±0.059）
14±1.5
（0.472 inches width）
（0.098max.）
（0.551±0.059）
Unit：mm（inch）
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_pack_e-E02R01
MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
－30～＋85℃
2. Storage Temperature Range
Specified Value
－30～＋85℃
※Note : －20 to +40℃ in taped packaging
Test Methods and
Remarks
3. Resistance to Flexure of Substrate
Specified Value
No mechanical damage.
Warp
: 2mm
Testing board
Thickness
: Glass epoxy-resin substrate
: 0.8mm
Test Methods and
Remarks
4. Adhesion of Electrode
Characteristics
: shall satisfy the electrical characteristics.
: No significant abnormality.
Specified Value
Appearance
Applied force
Duration
: 5N
: 10 sec.
Test Methods and
Remarks
5. Solderability
Specified Value
75% or more of immersed surface of terminal electrode shall be covered with fresh solder.
Solder temperature
Test Methods and Duration
Remarks Preconditioning
Immersion and Removal speed
: 230±5℃
: 4±1 sec
: Immersion into flux.
: 25mm/sec.
6. Resistance to Solder Heat
Characteristics
: shall satisfy the electrical characteristics.
: No significant abnormality.
Specified Value
Appearance
Preheating
: 150℃ for 2 min.
: 260±5℃
Solder temperature
Test Methods and Duration
Remarks Preconditioning
Immersion and Removal speed
Recovery
: 5±0.5 sec.
: Immersion into flux.
: 25mm/sec.
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_reli_e-E02R01
7. Thermal Shock
Specified Value
Characteristics
Appearance
: shall satisfy the electrical characteristics.
: No significant abnormality.
According to JIS C 0025.
Conditions for 1 cycle
Step
Temperature (℃)
Duration (min)
30±3
1
2
3
4
－40±3
Room Temperature
85±2
Within 3
30±3
Test Methods and
Remarks
Room Temperature
Within 3
Number of cycles
Mounting method
Recovery
: 100
: Soldering onto PC board.
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
8. Humidity (steady state)
Characteristics
: shall satisfy the electrical characteristics.
: No significant abnormality.
Specified Value
Appearance
Temperature
: ＋40±2℃
Test Methods and Humidity
: 90～95%RH
Remarks
Duration
: 96hrs
Recovery
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
9. High temperature life test
Characteristics
: shall satisfy the electrical characteristics.
: No significant abnormality.
Specified Value
Appearance
Temperature
Duration
: ＋85±2℃
Test Methods and
Remarks
: 96hrs
Recovery
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
10. Low temperature life test
Characteristics
: shall satisfy the electrical characteristics.
: No significant abnormality.
Specified Value
Appearance
Temperature
Duration
: －40±2℃
Test Methods and
Remarks
: 96hrs
Recovery
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
Note on standard condition:
"standard condition" referred to herein is defined as follows :
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement result :
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity and 86 to 106kPa of air
pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_reli_e-E02R01
MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS)
■PRECAUTIONS
1. PCB Design
◆Land pattern design
Land pattern dimension examples
FI212B245025
FI325P Type
FI212B Type
FI212L Type
FI212B190223
Unit：mm
Unit：mm
Unit：mm
Unit：mm
FI168T/D Type
FI168B/L Type
FI168P Type
FI212C Type
Technical
considerations
Unit：mm
Unit：mm
Unit：mm
Unit：mm
FI212P Type
FI212 P3960A4
FI105B/L Type
Unit：mm
Unit：mm
Unit：mm
2. Soldering
◆Conditions for Reflow soldering (for reference)
【Reflow Profile】
300
300
200
100
0
Peak
260℃ Max.
Within 10sec.
Preheating
230℃
Within 10sec.
60sec. 60sec
Min.
Min.
200
100
0
Slow
Slow cooling
※ Components should be preheated to within 100
to 130℃ from soldering temperature.
※ Assured to be reflow soldering for 2 times.
cooling
Technical
considerations
Note : The above profiles are the maximum
allowable soldering condition, therefore
these profiles are not always
recommended.
Heating above
230℃
40sec. Max.
Preheating150℃
60sec. Min.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_prec_e-E02R01
3. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・ Recommended conditions
Ambient temperature : －20～＋40℃
Precautions
Humidity : Below 70%RH
The ambient temperature must be kept below 30℃.
Even under ideal storage conditions, the solderbility of electrodes decreases gradually, so filters should be mounted within 6 months
from the time of delivery.
・ The packaging material should be kept where no chlorine or sulfur exists in the air.
◆Storage
Technical
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/ packaging materials may take place. For this reason, components should be used within 6
months from the time of delivery. If exceeding the above period, please check the solderability before using the filter.
considerations
■ Please contact of our offices for further details of specifications.
All of the standard values listed here are subject to change without notice.
Therefore, please check the specifications carefully before use.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_prec_e-E02R01
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